Concepedia

Tingyu Lin

TL

Statistics

Publications

17

Citations

694

H-Index

14

Active since

1996

Affiliations

National Center for Advanced Packaging (China)(Current)

Chinese Academy of Sciences

Institute of Microelectronics

Delft University of Technology

Shanghai University of Engineering Science

Tingyu Lin is an author at National Center for Advanced Packaging (China) specializing in engineering, heat transfer, and chip packaging.

Publications per year

1996–2024

17

Publications

17

Review of Packaging Schemes for Power Module

Fengze Hou, Wenbo Wang, Liqiang Cao et al. · IEEE Journal of Emerging and Selected Topics in Power Electronics · 2019 · 146 citations · Full text

Engineering, Electrical Engineering, Materials Science +17

Moisture diffusion and heat transfer in plastic IC packages

A.A.O. Tay, Tingyu Lin · IEEE Transactions on Components Packaging and Manufacturing Technology Part A · 1996 · 111 citations

Engineering, Materials Engineering, Materials Science +17

Experimental Verification and Optimization Analysis of Warpage for Panel-Level Fan-Out Package

Fengze Hou, Tingyu Lin, Liqiang Cao et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2017 · 75 citations

Engineering, Materials Engineering, Materials Science +15

A Theoretical Model for Axial Heat Conduction Effects During Single-Phase Flow in Microchannels

Tingyu Lin, Satish G. Kandlikar · Journal of Heat Transfer · 2011 · 52 citations

Engineering, Mechanical Engineering, Physics +17

An Experimental Investigation of Structured Roughness Effect on Heat Transfer During Single-Phase Liquid Flow at Microscale

Tingyu Lin, Satish G. Kandlikar · Journal of Heat Transfer · 2012 · 39 citations

Engineering, Manufacturing Engineering, Heat Transfer +16

1–5 of 17