Applied Physics Letters · 2002 · 12 citations · 14 references
EngineeringMaterials EngineeringMaterials ScienceElectronic MaterialsSemiconductor DevicesSemiconductor MaterialsCarrier TransportDiffusion In SolidsDopingIon ImplantationSemiconductor Device MaterialsSemiconductor PhysicsBoron CarbideBoron IncorporationSilicon CarbideSilicon Carbide (Sic) MaterialsTransient Enhanced Diffusion
Experimental evidence is given for boron (B) enhanced diffusion of nitrogen (N) in ion-implanted 4H silicon carbide (4H-SiC), when a nitrogen implant is co-doped within an existing boron p-type well. The co-implanted nitrogen is shown to diffuse continuously with time when samples are annealed at 1600 °C—with little movement of the boron p-well implant profile. An effective nitrogen in boron diffusivity at 1600 °C is determined to be at least 60 times larger than that of a mono-doped nitrogen implant.
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Point defects and dopant diffusion in silicon
P. Fahey, Peter B. Griffin, J.D. Plummer · Reviews of Modern Physics · 1989 · 1.4K citations