28 nm pitch of line/space pattern transfer into silicon substrates with chemo-epitaxy Directed Self-Assembly (DSA) process flow

Boon Teik Chan, Shigeru Tahara, Doni Parnell, Paulina A. Rincon Delgadillo, Roel Gronheid, Jean‐François de Marneffe, Kaidong Xu, Eiichi Nishimura, Werner Boullart

Microelectronic Engineering · 2014 · 17 citations · 5 references

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