Bonding Alignment is a precision positioning process in wafer bonding that ensures accurate registration of alignment marks on two wafers to achieve proper layer-to-layer overlay during direct or indirect bonding.
88
Publications
3K
Citations
420
Authors
104
Institutions
Publications per year
2017–2026
15
Variants
Wafer Bonding Alignment
Parents
Publications
88
Advances, challenges and opportunities in 3D CMOS sequential integration
P. Batude, M. Vinet, B. Prévitali et al. · 2011 · 148 citations · Full text
Challenges for 3D IC integration: bonding quality and thermal management
Patrick Leduc, N. Sillon, Didier Louis et al. · 2007 · 95 citations
1–5 of 88
Authors
420
- MK
9
h-index
- TF
8
h-index
- TT
7
h-index
- RG
5
h-index
- JC
5
h-index
1–5 of 420
Institutions
104
Tohoku University
Sendai, Japan
10 h-index
55 publications
2K citations
Laboratoire d'Électronique des Technologies de l'Information
Grenoble, France
9 h-index
71 publications
5.8K citations
Commissariat à l'Énergie Atomique et aux Énergies Alternatives
Paris, France
9 h-index
74 publications
6.1K citations
CEA Grenoble
Grenoble, France
7 h-index
60 publications
5.1K citations
Rensselaer Polytechnic Institute
Troy, United States
7 h-index
45 publications
1.4K citations
Institut polytechnique de Grenoble
Grenoble, France
4 h-index
21 publications
903 citations
IMEC
Leuven, Belgium
4 h-index
34 publications
842 citations
STMicroelectronics (France)
Montrouge, France
4 h-index
8 publications
704 citations
1–8 of 104
Venues
- Microelectronics Reliability
4 publications · 127 citations
4
h-index
- Applied Physics Letters
3 publications · 197 citations
3
h-index
- Journal of The Electrochemical Society
JES · 2 publications · 165 citations
2
h-index
- Japanese Journal of Applied Physics
JJAP · 2 publications · 101 citations
2
h-index
- Micromachines
2 publications · 45 citations
2
h-index
1–5