IEEE Transactions on Nuclear Science · 2021 · 12 citations · 24 references
EngineeringIntegrated CircuitsVacuum DeviceSilicon On InsulatorDefect ToleranceSemiconductor-insulator InterfacesInterconnect (Integrated Circuits)Ion ImplantationAdvanced Packaging (Semiconductors)Surface RecombinationElectronic PackagingElectrical EngineeringSoi TechnologyHardware ReliabilityPhysicsBias Temperature InstabilitySingle Event EffectsSemiconductor Device FabricationSingle-event Charge CollectionDevice ReliabilityMicroelectronicsSurface ScienceApplied PhysicsStrike Location
Semiconductor-insulator interfaces play an important role in the reliability of integrated devices; however, the impact of these interfaces on the physical mechanisms related to single-event effects has not been previously reported. We present experimental data that demonstrate that single-event charge collection can be impacted by changes in interface quality. The experimental data, combined with simulations, show that single-event response may depend on surface recombination at interface defects. The effect depends on strike location and increases with increasing linear energy transfer (LET). Surface recombination can affect single-event charge collection for interfaces with a surface recombination velocity (SRV) of 1000 cm/s and is a dominant charge collection mechanism with SRV >10 <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">5</sup> cm/s.
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Radiation Effects in MOS Oxides
James R. Schwank, M.R. Shaneyfelt, Daniel M. Fleetwood et al. · IEEE Transactions on Nuclear Science · 2008 · 901 citations
Hafnium Oxides, Electrical Engineering, Electronic Devices +13
Radiation effects in SOI technologies
J.R. Schwank, V. Ferlet-Cavrois, M.R. Shaneyfelt et al. · IEEE Transactions on Nuclear Science · 2003 · 430 citations