Applied Physics Letters · 2019 · 39 citations · 19 references
EngineeringElectrical EngineeringMaterials ScienceMicroelectronicsSemiconductor DevicesSemiconductor MaterialsDopingField-effect TransistorsMetal-oxide-semiconductor Field-effect TransistorsSemiconductor Device MaterialsWide-bandgap Semiconductor DevicesWide-bandgap SemiconductorsBreakdown VoltageChannel DopingChannel Doping EffectsCurrent DensityElectron DensityHigh-electron-mobility TransistorsHigh-voltage BreakdownMetal-semiconductor Field-effect Transistors
Polarization-doped field effect transistors (PolFETs) were realized with an unintentionally doped AlxGa1-xN channel layer graded over Al compositions 0.60 ≤ x ≤ 1.0 with a maximum current density of 188 mA/mm (+10 V gate-to-source bias) and an on-resistance of 85 mΩ mm. The average mobility in the PolFET channel was estimated to be 320 cm2/V s, which exceeds that of previous AlGaN metal-semiconductor field effect transistors (MESFETs) and heterojunction field effect transistors (HFETs) of similar Al composition. The breakdown voltage was greater than 620 V, indicating an average critical electric field of >210 V/μm, which is substantially better than ∼100 V/μm that is typically achieved in GaN HFETs. These findings demonstrate that Al-rich PolFETs are attractive alternatives to MESFETs and HFETs for achieving simultaneously high channel electron density and mobility in high voltage switches.
19
An AlN/Al0.85Ga0.15N high electron mobility transistor
Albert G. Baca, Andrew Armstrong, Andrew A. Allerman et al. · Applied Physics Letters · 2016 · 144 citations · Full text
AlN/AlGaN HEMTs on AlN substrate for stable high‐temperature operation
Norimasa Yafune, S. Hashimoto, K. Akita et al. · Electronics Letters · 2014 · 102 citations · Full text