Effect of Solder-Joint Geometry on the Low-Cycle Fatigue Behavior of Sn-xAg-0.7Cu

Experimental studies of board-level reliability of chip-scale packages subjected to JEDEC drop test condition

Yi‐Shao Lai, Ping‐Feng Yang, Chang-Lin Yeh · Microelectronics Reliability · 2005 · 180 citations

Engineering, Computer Engineering, Packaging Design +14

Effect of silver content on thermal fatigue life of Sn-xAg-0.5Cu flip-chip interconnects

Shin‐Ichi Terashima, Yoshiharu Kariya, Takuya Hosoi et al. · Journal of Electronic Materials · 2003 · 175 citations

Engineering, Materials Engineering, Materials Science +16

Effects of Ag content on fracture resistance of Sn–Ag–Cu lead-free solders under high-strain rate conditions

Daewoong Suh, Dong Wook Kim, Pilin Liu et al. · Materials Science and Engineering A · 2007 · 156 citations

Natural Sciences, Materials Engineering, Materials Science +16

Comparison of isothermal mechanical fatigue properties of lead-free solder joints and bulk solders

C. Andersson, Z. Lai, J. Liu et al. · Materials Science and Engineering A · 2005 · 119 citations

Natural Sciences, Materials Engineering, Materials Science +14

Reliability of Sn–Ag–Sb lead-free solder joints

Hwa-Teng Lee, H. Lin, Cheng-Shyan Lee et al. · Materials Science and Engineering A · 2005 · 105 citations

Engineering, Materials Engineering, Materials Science +6