Concepedia

Hwa-Teng Lee

HL

9

Publications

339

Citations

9

H-Index

2002

Active since

Affiliations

National Cheng Kung University(Current)

Southern Taiwan University of Science and Technology

Hwa-Teng Lee is an author at National Cheng Kung University specializing in materials science, engineering, and microstructure.

Top concepts

Publications per year

2002–2020

9

Publications

9

Influence of intermetallic compounds on the adhesive strength of solder joints

Hwa-Teng Lee, Ming-Hung Chen · Materials Science and Engineering A · 2002 · 128 citations

, , +7

Effect of adding Sb on microstructure and adhesive strength of Sn-Ag solder joints

Hwa-Teng Lee, Ming-Hung Chen, Huei-Mei Jao et al. · Journal of Electronic Materials · 2004 · 56 citations

, , +5

Evolution of Ag3Sn intermetallic compounds during solidification of eutectic Sn–3.5Ag solder

Hwa-Teng Lee, Yin-Fa Chen · Journal of Alloys and Compounds · 2010 · 47 citations

, , +7

Effects of Cooling Rate on the Microstructure and Morphology of Sn-3.0Ag-0.5Cu Solder

Hwa-Teng Lee, Kuo-Chen Huang · Journal of Electronic Materials · 2015 · 30 citations

, , +8

Fine Grains Forming Process, Mechanism of Fine Grain Formation and Properties of Superalloy 718

Hwa-Teng Lee, Wen-Hsin Hou · MATERIALS TRANSACTIONS · 2012 · 22 citations · Full text

, , +16

Rows per page

1–5 of 9