Effect of adding Sb on microstructure and adhesive strength of Sn-Ag solder joints

Microstructure evolution of eutectic Sn-Ag solder joints

Wenge Yang, Robert W. Messler, L.E. Felton · Journal of Electronic Materials · 1994 · 270 citations

Materials Science, Materials Engineering, Friction Welding +5

A viable tin-lead solder substitute: Sn-Ag-Cu

Chad M. Miller, Iver E. Anderson, Jack Smith · Journal of Electronic Materials · 1994 · 261 citations

Materials Science, Materials Engineering, Engineering +4

Influence of interfacial intermetallic compound on fracture behavior of solder joints

Hwa-Teng Lee, Ming‐Hung Chen, Huei-Mei Jao et al. · Materials Science and Engineering A · 2003 · 242 citations

Materials Science, Friction Welding, Engineering +9

Improved mechanical properties in new, Pb-free solder alloys

M. McCormack, S. Jin · Journal of Electronic Materials · 1994 · 167 citations

Materials Science, Engineering, Mechanical Engineering +5

A thermodynamic study on the AgSbSn system

Chang-Seok Oh, Jae-Hyeok Shim, Byeong‐Joo Lee et al. · Journal of Alloys and Compounds · 1996 · 139 citations