Comparison of isothermal mechanical fatigue properties of lead-free solder joints and bulk solders

Six cases of reliability study of Pb-free solder joints in electronic packaging technology

Ke Zeng, K. N. Tu · Materials Science and Engineering R Reports · 2002 · 1.4K citations

Engineering, Materials Engineering, Materials Science +15

Foreword contributions from the 50th electronic components and technology conference

R. Boudreau · IEEE Transactions on Advanced Packaging · 2001 · 519 citations

Engineering, Computer Engineering, Electrical Engineering +16

Fatigue of 60/40 Solder

H. D. Solomon · IEEE Transactions on Components Hybrids and Manufacturing Technology · 1986 · 300 citations

Natural Sciences, Materials Engineering, Materials Science +17

Solder Joint Reliability—Theory and Applications

John H. Lau, Peter A. Engel · Journal of Electronic Packaging · 1992 · 262 citations · Full text

Engineering, Manufacturing Engineering, Fault Tolerance +9

Low cycle fatigue analysis of temperature and frequency effects in eutectic solder alloy

Xu Shi · International Journal of Fatigue · 2000 · 166 citations

Natural Sciences, Materials Engineering, Materials Science +16