Z. Lai

Evaluation of microstructural development in electron beam melted Ti-6Al-4V

Aqsa Safdar, L.-Y. Wei, Anders Snis et al. · Materials Characterization · 2011 · 239 citations

Materials Science, Engineering, Powder Metallurgy +4

Comparison of isothermal mechanical fatigue properties of lead-free solder joints and bulk solders

C. Andersson, Z. Lai, J. Liu et al. · Materials Science and Engineering A · 2005 · 118 citations

Materials Science, Engineering, Durability Performance +8

A reliable and environmentally friendly packaging technology-flip-chip joining using anisotropically conductive adhesive

J. Liu, A. Tolvgard, J. Malmodin et al. · IEEE Transactions on Components and Packaging Technologies · 1999 · 106 citations

Engineering, Radio Base Station, Biomedical Engineering +18

Overview of conductive adhesive joining technology in electronics packaging applications

J. Liu, Z. Lai, Helge Kristiansen et al. · 2002 · 68 citations

Engineering, Advanced Packaging (Semiconductors), Electronic Packaging +16

1.58 μ m InGaAs quantum well laser on GaAs

Ivar Tångring, H. Q. Ni, Baojun Wu et al. · Applied Physics Letters · 2007 · 62 citations

Engineering, Laser Science, Laser Applications +17