Concepedia

Author

J. Malmodin

Ericsson (Sweden)

Also Known As

J. Malmodin

2

Publications

128

Citations

2

H-Index

14

Concepts

All Affiliations

Ericsson (Sweden)Swedish Institute
JM

About

J. Malmodin is an author at Ericsson (Sweden) specializing in microelectronics, electronic packaging, and adhesive materials.

Top Concepts

#ConceptH-IndexPublicationsCitations

1

Engineering

2

2

128

2

Biomedical Engineering

2

2

128

3

Electrical Engineering

2

2

128

4

Applied Physics

1

1

106

5

Materials Engineering

1

1

22

J. Malmodin

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2

Publications

128

Citations

2

H-Index

YearCitations

A reliable and environmentally friendly packaging technology-flip-chip joining using anisotropically conductive adhesive

J. Liu, A. Tolvgard, J. Malmodin,

IEEE Transactions on Components and Packaging Technologies

1999

106

A reliable and environmentally friendly packaging technology-flip chip joining using anisotropically conductive adhesive

A. Tolvgard, J. Malmodin, J. Liu,

2002

22

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