Concepedia

J. Malmodin

JM

2

Publications

128

Citations

2

H-Index

1999

Active since

Affiliations

Ericsson (Sweden)(Current)

Swedish Institute

J. Malmodin is an author at Ericsson (Sweden) specializing in microelectronics, electronic packaging, and adhesive materials.

Top concepts

AntennaEngineeringMaterial ScienceMicroelectronicsMicrofabricationAdhesive MaterialsElectronic PackagingBiomedical EngineeringElectrical EngineeringApplied Physics

Publications per year

1999–2002

2

Publications

2

A reliable and environmentally friendly packaging technology-flip-chip joining using anisotropically conductive adhesive

J. Liu, A. Tolvgard, J. Malmodin et al. · IEEE Transactions on Components and Packaging Technologies · 1999 · 106 citations

Engineering, Radio Base Station, Biomedical Engineering +18

A reliable and environmentally friendly packaging technology-flip chip joining using anisotropically conductive adhesive

A. Tolvgard, J. Malmodin, J. Liu et al. · 2002 · 22 citations

Engineering, Biomedical Engineering, Advanced Packaging (Semiconductors) +19

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