J. Liu

A reliable and environmentally friendly packaging technology-flip-chip joining using anisotropically conductive adhesive

J. Liu, A. Tolvgard, J. Malmodin et al. · IEEE Transactions on Components and Packaging Technologies · 1999 · 106 citations

Engineering, Radio Base Station, Biomedical Engineering +18

Overview of conductive adhesive joining technology in electronics packaging applications

J. Liu, Z. Lai, Helge Kristiansen et al. · 2002 · 68 citations

Engineering, Advanced Packaging (Semiconductors), Electronic Packaging +16

Surface characteristics, reliability, and failure mechanisms of tin/lead, copper, and gold metallizations

J. Liu, K. Gustafsson, Z. Lai et al. · IEEE Transactions on Components Packaging and Manufacturing Technology Part A · 1997 · 56 citations

Electrical Resistance, Engineering, Mechanical Engineering +20

A method for determining elastic properties of micron-sized polymer particles by using flat punch test

Z.L. Zhang, Helge Kristiansen, J. Liu · Computational Materials Science · 2006 · 51 citations

Materials Science, Micron-sized Polymer Particles, Engineering +12

Reliability of Surface‐mounted Anisotropically Conductive Adhesive Joints

J. Liu · Circuit World · 1993 · 41 citations

Materials Science, Adhesive Joint Reliability, Engineering +8