J. Liu - Concepedia

Author

J. Liu

Swedish Institute ORCID

Also Known As

J. LIU, J. Liu, JIACHEN LIU, Jin Yu Liu, Jin-Hui Liu, Jinhui Liu

Publications

720

Citations

H-Index

Concepts

All Affiliations

Swedish Institute Chalmers University of Technology Shanghai University Conpart (Norway)Portland State University

About

J. Liu is an author at Swedish Institute specializing in engineering, materials science, and mechanical engineering.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	15	20	632
2	Electrical Engineering	10	10	359
3	Applied Physics	4	4	257
4	Biomedical Engineering	2	2	128
5	Education	1	1	11

J. Liu

Publications

642

Citations

H-Index

Page 1

	Year	Citations
A reliable and environmentally friendly packaging technology-flip-chip joining using anisotropically conductive adhesive J. Liu, A. Tolvgard, J. Malmodin, IEEE Transactions on Components and Packaging Technologies EngineeringRadio Base StationBiomedical EngineeringTechnology-flip-chip JoiningAdvanced Packaging (Semiconductors)	1999	106
Overview of conductive adhesive joining technology in electronics packaging applications J. Liu, Z. Lai, Helge Kristiansen, EngineeringAdvanced Packaging (Semiconductors)Electronic PackagingCurrent StatusMaterials Science	2002	68
Surface characteristics, reliability, and failure mechanisms of tin/lead, copper, and gold metallizations J. Liu, K. Gustafsson, Z. Lai, IEEE Transactions on Components Packaging and Manufacturing Technology Part A Electrical ResistanceEngineeringMechanical EngineeringMetallurgical SystemGold Metallization	1997	56
A method for determining elastic properties of micron-sized polymer particles by using flat punch test Z.L. Zhang, Helge Kristiansen, J. Liu Computational Materials Science Materials ScienceMicron-sized Polymer ParticlesEngineeringMicromechanicsFlat Punch Test	2006	51
Reliability of Surface‐mounted Anisotropically Conductive Adhesive Joints J. Liu Circuit World Materials ScienceAdhesive Joint ReliabilityEngineeringDurability PerformanceCorrosion	1993	41
Recent advances in conductive adhesives for direct chip attach applications J. Liu Microsystem Technologies Materials ScienceElectrical EngineeringEngineeringAdvanced Packaging (Semiconductors)Microfabrication	1998	37
Conduction modelling of a conductive adhesive with bimodal distribution of conducting element Yifeng Fu, J. Liu, M. Willander International Journal of Adhesion and Adhesives Materials ScienceElectrical EngineeringEngineeringMechanicsConductive Adhesive	1999	34
On the failure mechanism of anisotropically conductive adhesive joints on copper metallisation J. Liu International Journal of Adhesion and Adhesives Materials EngineeringMaterials ScienceCopper MetallisationElectromigration TechniqueEngineering	1996	32
Statistics of electric conductance through anisotropically conductive adhesive Ying Fu, M. Willander, J. Liu IEEE Transactions on Components and Packaging Technologies Materials ScienceElectrical EngineeringElectromigration TechniqueEngineeringInterface Phenomenon	2001	27
Development of Flip‐chip Joining Technology on Flexible Circuitry Using Anistropically Conductive Adhesives and Eutectic Solder* J. Liu, K. Boustedt, Z. Lai Circuit World EngineeringFlip‐chip Joining TechnologyIntegrated CircuitsInterconnect (Integrated Circuits)Advanced Packaging (Semiconductors)	1996	23

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