IEEE Electron Device Letters · 2001 · 80 citations · 8 references
EngineeringAnalysis PackagesSemiconductor DeviceDielectric ThicknessQuantum ComputingNanoelectronicsQuantum SimulationQuantum-mechanical Capacitance-voltage SimulatorsElectronic PackagingDevice ModelingQuantum ScienceElectrical EngineeringPhysicsExtensive EnsembleTime-dependent Dielectric BreakdownElectrical InsulationMicroelectronicsApplied PhysicsCircuit Simulation
We have systematically compared the results of an extensive ensemble of the most advanced available quantum-mechanical capacitance-voltage (C-V) simulation and analysis packages for a range of metal-oxide-semiconductor device parameters. While all have similar trends accounting for polysilicon depletion and quantum-mechanical confinement, quantitatively, there is a difference of up to 20% in the calculated accumulation capacitance for devices with ultrathin gate dielectrics. This discrepancy leads to large inaccuracies in the values of dielectric thickness extracted from capacitance measurements and illustrates the importance of consistency during C-V analysis and the need to fully report how such analysis is done.
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W.K. Henson, Khaled Ahmed, Eric M. Vogel et al. · IEEE Electron Device Letters · 1999 · 162 citations
Materials Engineering, High-frequency Capacitance-voltage, Electrical Engineering +13