IEEE Electron Device Letters · 2007 · 25 citations · 9 references
EngineeringElectrical EngineeringElectronic MaterialsMicroelectronicsSemiconductor DevicesCurrent-voltage CharacteristicsDevice CharacterizationDevice ModelingField-effect TransistorsIntegrated Circuit DesignMetal-oxide-semiconductor Field-effect TransistorsElectron Impact IonizationFin Field-effect TransistorsIonizationIonization ParameterMeasurementMetal-oxide-semiconductor Field-effect Transistor ModelingSeries ResistanceThickness Dependence
<para xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> The body thickness dependence of impact ionization for a multiple-gate fin field-effect transistor (FinFET) is presented. It is found that the nonlocal effect and series resistance are distinct features of reduced impact ionization in the multiple-gate FinFET, and these effects become more pronounced as the body thickness decreases. The impact ionization constant <formula formulatype="inline"><tex>$B_{i}$</tex></formula> is newly extracted by considering the series resistance and nonlocal carrier heating effect. A refined analytical substrate current model is developed from the previous model and revamped for multiple-gate devices. The new substrate current model is then compared with measurement data, and good agreement is observed. </para>
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A unified model for hot-electron currents in MOSFET's
P.K. Ko, R.S. Muller, Chenming Hu · 1981 · 98 citations
Reliability study of CMOS FinFETs
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Engineering, Electrical Engineering, Electronic Materials +16