Journal of Vacuum Science & Technology B Nanotechnology and Microelectronics Materials Processing Measurement and Phenomena · 2015 · 19 citations · 12 references
Natural SciencesMaterials EngineeringMaterials ScienceComputational Materials ScienceMaterials CharacterizationThin FilmsDielectric MaterialsDielectric PropertiesDielectric ResponseDielectricsPorous CeramicsPorous MaterialsCalculation MethodologyDielectric CharacterizationDielectric ConstantLow-k DielectricsPore Size EffectsPoresPorosity EffectsPorosity-property Relationships
A simple, clear, and robust numerical approach to calculate dielectric constant of porous organosilicate (SiOCH) based films with arbitrary shaped pores is proposed. The calculations are based on modified Clausius–Mossotti equation and can be applied for the films with wide range of porosity (0.01–0.96) and pore size (0.5–5 nm). The dielectric constants calculated in assumption of preferential localization of CH3 groups on pore wall are in good agreement with the experimentally measured k-values. The advantage of the proposed calculation model is ability to analyze the dependence of dielectric constant on pore size.
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Low dielectric constant materials for microelectronics
Karen Maex, Mikhaı̈l R. Baklanov, Denis Shamiryan et al. · Journal of Applied Physics · 2003 · 1.6K citations
Natural Sciences, Materials Engineering, Materials Science +17
Determination of pore size distribution in thin films by ellipsometric porosimetry
Mikhaı̈l R. Baklanov, K. P. Mogilnikov, V. G. Polovinkin et al. · Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena · 2000 · 509 citations
Natural Sciences, Chemical Engineering, Materials Science +17