IEEE Electron Device Letters · 2015 · 22 citations · 19 references
EngineeringElectrical EngineeringMaterials ScienceMicroelectronicsSemiconductor DevicesSemiconductor MaterialsIii-v SemiconductorsSemiconductor Device MaterialsSemiconductor InterfacesSemiconductor PhysicsWide Band Gap SemiconductorsWide-bandgap Semiconductor DevicesBand Offset EngineeringBand OffsetsContact ResistanceGallium Nitride (Gan) MaterialsHeterostructure TransistorsInterfacial ResistanceOhmic ContactsTotal Resistance
We report on a new approach to achieve nonalloyed ohmic contacts with record low resistance in GaN-based transistors. We use upward and reverse grading of Al composition in a polarization-graded field-effect transistor structure to eliminate abrupt heterojunction band offsets and create direct contact to the channel. Total contact resistance of 73 mQ · mm and interfacial resistance of 29 mQ · mm to the 2-D electron gas were obtained. The method adopted here could enable to ultralow-resistance contacts without ohmic recess.
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InAlN/AlN/GaN HEMTs With Regrown Ohmic Contacts and $f_{T}$ of 370 GHz
Yuanzheng Yue, Zongyang Hu, Jia Guo et al. · IEEE Electron Device Letters · 2012 · 336 citations
Umesh K. Mishra, Yifeng Wu, B.P. Keller et al. · IEEE Transactions on Microwave Theory and Techniques · 1998 · 227 citations
Umesh K. Mishra, Yifeng Wu, B.P. Keller et al. · 2002 · 203 citations