Ball Impact Reliability of Zn-Sn High-Temperature Solder Joints Bonded with Different Substrates

An improved technique for determining hardness and elastic modulus using load and displacement sensing indentation experiments

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High-temperature lead-free solders: Properties and possibilities

Katsuaki Suganuma, Seongjun Kim, Keun‐Soo Kim · JOM · 2009 · 347 citations

Natural Sciences, Materials Engineering, Materials Science +10

Plasticity characteristic obtained through hardness measurement

Yu.V. Milman, Boris A. Galanov, S. І. Chugunova · Acta Metallurgica et Materialia · 1993 · 227 citations

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Experimental studies of board-level reliability of chip-scale packages subjected to JEDEC drop test condition

Yi‐Shao Lai, Ping‐Feng Yang, Chang-Lin Yeh · Microelectronics Reliability · 2005 · 180 citations

Engineering, Computer Engineering, Packaging Design +14

High-Temperature Operation of SiC Power Devices by Low-Temperature Sintered Silver Die-Attachment

Jian Yin, Zhiye Zhang, Guo‐Quan Lu et al. · IEEE Transactions on Advanced Packaging · 2007 · 174 citations

Engineering, Electrical Engineering, Materials Engineering +15