Tsung-Yun Pai

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Active since

2013

Affiliations

Advanced Semiconductor Engineering (Taiwan)(Current)

Tsung-Yun Pai is an author at Advanced Semiconductor Engineering (Taiwan) specializing in semiconductor devices, materials science, and electronic materials.

Publications per year

2013–2015

Publications

Ball Impact Reliability of Zn-Sn High-Temperature Solder Joints Bonded with Different Substrates

Jenn‐Ming Song, Meng‐Ju Lin, Kun-Hung Hsieh et al. · Journal of Electronic Materials · 2013 · 16 citations

Natural Sciences, Materials Engineering, Materials Science +13

Challenge and process optimization of Thermal Compression bonding with Non Conductive Paste

Po‐Jen Cheng, Wen-Chun Wu, Wu-Lung Wang et al. · 2015 · 10 citations

Engineering, Electrical Engineering, Materials Science +11

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