WNx diffusion barriers between Si and Cu

Influence of dislocations on diffusion kinetics in solids with particular reference to the alkali halides

Lionel G. Harrison · Transactions of the Faraday Society · 1961 · 953 citations

Materials Science, Materials Engineering, Humanities +15

Tantalum as a diffusion barrier between copper and silicon: Failure mechanism and effect of nitrogen additions

Karen Holloway, P. M. Fryer, C. Cabral et al. · Journal of Applied Physics · 1992 · 445 citations

Engineering, Chemistry, Chemical Deposition +16

Advanced multilayer metallization schemes with copper as interconnection metal

S. P. Murarka, R.J. Gutmann, Alain E. Kaloyeros et al. · Thin Solid Films · 1993 · 245 citations

Materials Science, Materials Engineering, Engineering +5

Reactively sputtered TiN as a diffusion barrier between Cu and Si

Shiqing Wang, Ivo J. Raaijmakers, Brad J. Burrow et al. · Journal of Applied Physics · 1990 · 244 citations

Engineering, Sputtered Tin, Thin Film Process Technology +19

Tantalum-based diffusion barriers in Si/Cu VLSI metallizations

E. Kolawa, Jen‐Sue Chen, J.S. Reid et al. · Journal of Applied Physics · 1991 · 222 citations · Full text

Materials Engineering, Materials Science, Electrical Engineering +15