J.S. Reid - Concepedia

Concepedia

Author

J.S. Reid

California Institute of Technology

Also Known As

J. S. Reid, J.S Reid, J.S. Reid, Jason S. Reid

28

Publications

1.2K

Citations

16

H-Index

24

Concepts

All Affiliations

California Institute of Technology Jet Propulsion Laboratory Sandia National Laboratories

JR

About

J.S. Reid is an author at California Institute of Technology specializing in materials science, engineering, and applied physics.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	14	14	869
2	Applied Physics	13	13	849
3	Electrical Engineering	3	3	338
4	Chemical Engineering	2	2	57
5	Chemistry	1	1	20

J.S. Reid

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16

Publications

1.2K

Citations

16

H-Index

	Year	Citations
Tantalum-based diffusion barriers in Si/Cu VLSI metallizations E. Kolawa, Jen‐Sue Chen, J.S. Reid, Journal of Applied Physics Materials EngineeringMaterials ScienceElectrical EngineeringCu OverlayersEngineering	1991	222
Evaluation of amorphous (Mo, Ta, W)SiN diffusion barriers for 〈Si〉\|Cu metallizations J.S. Reid, E. Kolawa, R. Ruiz, Thin Solid Films	1993	164
Properties of reactively sputter-deposited TaN thin films Xin Sun, Elzbieta Kolawa, Jen‐Sue Chen, Thin Solid Films	1993	134
Reactively sputtered Ti-Si-N films I. Physical properties Xin Sun, J.S. Reid, E. Kolawa, Journal of Applied Physics EngineeringThin Film Process TechnologyPhysical PropertiesSemiconductorsTernary Phase Diagram	1997	109
Ti-Si-N diffusion barriers between silicon and copper J.S. Reid, Xin Sun, E. Kolawa, IEEE Electron Device Letters SemiconductorsMaterials ScienceEngineeringDiffusion ResistancePhysics	1994	81
Amorphous (Mo, Ta, or W)–Si–N diffusion barriers for Al metallizations J.S. Reid, E. Kolawa, C. M. Garland, Journal of Applied Physics Aluminium NitrideEngineeringSecondary-ion-mass SpectrometrySemiconductorsElectron Microscopy	1996	71
Sputtered Ta-Si-N diffusion barriers in Cu metallizations for Si E. Kolawa, P.J. Pokela, J.S. Reid, IEEE Electron Device Letters Materials ScienceMaterials EngineeringElectrical EngineeringSemiconductorsEngineering	1991	70
Reactively sputtered Ti-Si-N films. II. Diffusion barriers for Al and Cu metallizations on Si Xin Sun, J.S. Reid, E. Kolawa, Journal of Applied Physics Ti-si-n BarriersEngineeringThin Film Process TechnologyChemical DepositionSemiconductors	1997	64
Performance of tantalum-silicon-nitride diffusion barriers between copper and silicon dioxide M. Angyal, Yosi Shacham‐Diamand, J.S. Reid, Applied Physics Letters Engineering10-Nm-thick Tantalum-silicon-nitrideThermal Silicon DioxideThin Film Process TechnologySilicon On Insulator	1995	46
Amorphous Ta-Si-N diffusion barriers in Si/Al and Si/Cu metallizations E. Kolawa, P.J. Pokela, J.S. Reid, Applied Surface Science Materials ScienceMaterials EngineeringEngineeringApplied PhysicsSi/cu Metallizations	1991	42

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