IEEE Transactions on Nuclear Science · 2012 · 15 citations · 23 references
EngineeringComputer EngineeringElectrical EngineeringMicroelectronicsSemiconductor DevicesVlsi DesignCmos Circuit DesignDevice ReliabilityDevice ScalingIntegrated Circuit DesignShort-channel EffectsStrain EngineeringLeakage Current ReductionStrain Effects
For advanced deep sub-micron technology nodes, the use of strained-Si is fast becoming the norm. The experimental Soft Error Rate of 40 nm technology Deep-N-well SRAMs that incorporate strained-Si PMOS transistors are compared with the SER for 90 nm, 65 nm and 45 nm Deep-N-Well bulk CMOS SRAMs fabricated without strain. Results indicate that the total SER decreases by approximately 50% with strain. Most importantly, however, the Multiple-Cell Upset Rate decreases significantly. The factors that result in improved SER for strained SRAMs are investigated.
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Characterization of multi-bit soft error events in advanced SRAMs
J. Maiz, S.A. Hareland, Kedong Zhang et al. · 2004 · 244 citations
Engineering, Computer Engineering, Electrical Engineering +16
Radiation-Induced Soft Error Rates of Advanced CMOS Bulk Devices
N. Seifert, P. Slankard, Martin Kirsch et al. · 2006 · 203 citations
Engineering, Computer Engineering, Electrical Engineering +17