Journal of Physics D Applied Physics · 2023 · 15 citations · 126 references
EngineeringElectrical EngineeringMaterials ScienceMicroelectronicsSemiconductor DevicesSemiconductor MaterialsDopingMetal-oxide-semiconductor Field-effect TransistorsSemiconductor Device MaterialsWide Band Gap SemiconductorsWide-bandgap Semiconductor DevicesWide-bandgap SemiconductorsFin Field-effect TransistorsGallium Nitride (Gan) MaterialsGallium Nitride Power DevicesIon Implantation EffectsJunction Field-effect TransistorsSchottky Barrier DiodesSelective DopingSelective Etching
Abstract Selective area doping in GaN, especially p-type, is a critical and inevitable building block for the realization of advanced device structures for high-power applications, including, but not limited to, current-aperture vertical electron transistors, junction termination extensions, junction barrier Schottky diodes, junction field-effect transistors (JFETs), vertical-channel JFETs, U-shaped metal–oxide–semiconductor field-effect transistors (U-MOSFETs), and Fin MOSFETs. This paper reviews and summarizes some of the recent advances in the fields of selective area etching and regrowth, ion implantation, and polarity-dependent doping that may lead to the practical realization of GaN-based power devices.
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InAlN/AlN/GaN HEMTs With Regrown Ohmic Contacts and $f_{T}$ of 370 GHz
Yuanzheng Yue, Zongyang Hu, Jia Guo et al. · IEEE Electron Device Letters · 2012 · 336 citations
Ion implantation doping and isolation of GaN
S. J. Pearton, C. B. Vartuli, J.C. Zolper et al. · Applied Physics Letters · 1995 · 300 citations