Non-destructive micro analysis of electromigration failures in solder microbumps using 3D X-ray computed tomography

Six cases of reliability study of Pb-free solder joints in electronic packaging technology

Ke Zeng, K. N. Tu · Materials Science and Engineering R Reports · 2002 · 1.3K citations

Reliability, Electrical Engineering, Reliability Engineering +10

Effects of intermetallic compounds on properties of Sn–Ag–Cu lead-free soldered joints

K.S. Kim, Seok‐Hwan Huh, Katsuaki Suganuma · Journal of Alloys and Compounds · 2003 · 607 citations

Materials Engineering, Materials Science, Friction Welding +4

Recent Advances and Trends in Advanced Packaging

John H. Lau · IEEE Transactions on Components Packaging and Manufacturing Technology · 2022 · 503 citations

Engineering, Ordinary Wlcsp, Advanced Packaging (Semiconductors) +20

Kirkendall void formation in eutectic SnPb solder joints on bare Cu and its effect on joint reliability

Kejun Zeng, R.J. Stierman, Tz-Cheng Chiu et al. · Journal of Applied Physics · 2004 · 435 citations

Engineering, Mechanical Engineering, Kirkendall Void Formation +16

X-ray computed microtomography of internal damage in fiber reinforced polymer matrix composites

Paul J. Schilling, BhanuPrakash R. Karedla, Arun K. Tatiparthi et al. · Composites Science and Technology · 2005 · 409 citations

Materials Science, Fiber Reinforcement, Fibre-reinforced Plastic +7