Kai-Cheng Shie

A kinetic model of copper-to-copper direct bonding under thermal compression

Kai-Cheng Shie, Andriy Gusak, K. N. Tu et al. · Journal of Materials Research and Technology · 2021 · 88 citations · Full text

Thermal Compression, Engineering, Severe Plastic Deformation +24

Low-Temperature Cu/SiO2 Hybrid Bonding with Low Contact Resistance Using (111)-Oriented Cu Surfaces

Jia-Juen Ong, Wei-Lan Chiu, Ou-Hsiang Lee et al. · Materials · 2022 · 65 citations · Full text

Failure Mechanisms of Cu–Cu Bumps under Thermal Cycling

Kai-Cheng Shie, Po-Ning Hsu, Yu-Jin Li et al. · Materials · 2021 · 42 citations · Full text

Materials Engineering, Materials Science, Cu-cu Bumps +15

Non-destructive micro analysis of electromigration failures in solder microbumps using 3D X-ray computed tomography

Dinh-Phuc Tran, Tzu-Wen Lin, Kai-Cheng Shie et al. · Materials Characterization · 2022 · 24 citations

Materials Science, Solder Microbumps, Electrical Engineering +10

Effect of Bonding Strength on Electromigration Failure in Cu–Cu Bumps

Kai-Cheng Shie, Po-Ning Hsu, Yu-Jin Li et al. · Materials · 2021 · 18 citations · Full text