Kai-Cheng Shie

Statistics

Publications

Citations

395

H-Index

Active since

2020

Affiliations

National Yang Ming Chiao Tung University(Current)

MediaTek (Taiwan)

Kai-Cheng Shie is an author at National Yang Ming Chiao Tung University specializing in materials engineering, materials science, and natural sciences.

ORCID

Publications per year

2020–2024

Publications

A kinetic model of copper-to-copper direct bonding under thermal compression

Kai-Cheng Shie, Andriy Gusak, K. N. Tu et al. · Journal of Materials Research and Technology · 2021 · 98 citations · Full text

Natural Sciences, Materials Engineering, Materials Science +17

Low-Temperature Cu/SiO2 Hybrid Bonding with Low Contact Resistance Using (111)-Oriented Cu Surfaces

Jia-Juen Ong, Wei-Lan Chiu, Ou-Hsiang Lee et al. · Materials · 2022 · 74 citations · Full text

Natural Sciences, Materials Engineering, Materials Science +15

Failure Mechanisms of Cu–Cu Bumps under Thermal Cycling

Kai-Cheng Shie, Po-Ning Hsu, Yu-Jin Li et al. · Materials · 2021 · 42 citations · Full text

Natural Sciences, Materials Engineering, Materials Science +13

Non-destructive micro analysis of electromigration failures in solder microbumps using 3D X-ray computed tomography

Dinh-Phuc Tran, Tzu-Wen Lin, Kai-Cheng Shie et al. · Materials Characterization · 2022 · 27 citations

Engineering, Electrical Engineering, Materials Engineering +15

Effect of Bonding Strength on Electromigration Failure in Cu–Cu Bumps

Kai-Cheng Shie, Po-Ning Hsu, Yu-Jin Li et al. · Materials · 2021 · 21 citations · Full text

Engineering, Electrical Engineering, Materials Engineering +17

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