Po-Ning Hsu

Effect of oxidation on electromigration in 2-µm Cu redistribution lines capped with polyimide

I-Hsin Tseng, Po-Ning Hsu, Wei-You Hsu et al. · Results in Physics · 2021 · 28 citations · Full text

Materials Engineering, Materials Science, Electrical Engineering +11

Artificial intelligence deep learning for 3D IC reliability prediction

Po-Ning Hsu, Kai-Cheng Shie, Kuan-Peng Chen et al. · Scientific Reports · 2022 · 18 citations · Full text

Low-Resistance and high-Strength Copper Direct Bonding in no-Vacuum Ambient Using Highly (111)-Oriented Nano-Twinned Copper

Jing Ye Juang, Kai Cheng Shie, Po-Ning Hsu et al. · 2019 · 16 citations

Engineering, Mechanical Engineering, Nano-twinned Copper +21

Single-crystal-like Cu joints with high strength and resistance to fatigue failures

Jia-Juen Ong, Dinh-Phuc Tran, You‐Yi Lin et al. · Materials Science and Engineering A · 2022 · 16 citations

Materials Science, Materials Engineering, High Strength +10

To suppress thermomigration of Cu–Sn intermetallic compounds in flip-chip solder joints

Yanrong Huang, Dinh-Phuc Tran, Po-Ning Hsu et al. · Journal of Materials Research and Technology · 2023 · 14 citations · Full text