I-Hsin Tseng

Effect of thermal stress on anisotropic grain growth in nano-twinned and un-twinned copper films

I-Hsin Tseng, Yun-Ting Hsu, Jihperng Leu et al. · Acta Materialia · 2021 · 56 citations

Materials Science, One-dimensional Material, Thermal Stress +10

Electromigration failure mechanisms of 〈1 1 1〉 -oriented nanotwinned Cu redistribution lines with polyimide capping

I-Hsin Tseng, Po-Ning Hsu, Tien-Lin Lu et al. · Results in Physics · 2021 · 46 citations · Full text

Materials Science, Cu Rdls, Electrical Engineering +14

Enhancement of electromigration lifetime of copper lines by eliminating nanoscale grains in highly <111>-oriented nanotwinned structures

Dinh-Phuc Tran, Hung-Hsuan Li, I-Hsin Tseng et al. · Journal of Materials Research and Technology · 2021 · 41 citations · Full text

Engineering, Interconnect (Integrated Circuits), Advanced Packaging (Semiconductors) +22

Kinetic study of grain growth in highly (111)-preferred nanotwinned copper films

Chih-Han Tseng, I-Hsin Tseng, Yu-Pei Huang et al. · Materials Characterization · 2020 · 39 citations

Materials Science, Engineering, Nanotwinned Copper Films +10

Effect of oxidation on electromigration in 2-µm Cu redistribution lines capped with polyimide

I-Hsin Tseng, Po-Ning Hsu, Wei-You Hsu et al. · Results in Physics · 2021 · 28 citations · Full text

Materials Engineering, Materials Science, Electrical Engineering +11