Thermal Analysis of AlGaN/GaN High-Electron Mobility Transistors Using I–V Pulsed Characterizations and Infra Red Microscopy

Niemat Moultif, Andrés Echeverri, Dominique Carisetti, Olivier Latry, Eric Joubert

IEEE Transactions on Device and Materials Reliability · 2019 · 12 citations · 9 references

Concepts

Abstract

This paper presents a method based on IV pulsed characterizations to estimate the junction temperature of AlGaN/GaN high-electron mobility transistors (AlGaN/GaN HEMTs). This technique allows a 2D plan evaluation of the average temperature of the transistor and the thermal resistance as a function of the dissipated power and the base plate temperature. In order to validate this method, our outcomes are compared with infra-red (IR) microscopy measurements realized with a Quantum Focus Instrument (QFI) Infrascope. The measured data show a good agreement with the results of our approach. Further analyses are carried out with IR microscopy to investigate the dependence of temperature on electrical parameters.

References

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