IEEE Transactions on Device and Materials Reliability · 2019 · 12 citations · 9 references
EngineeringElectrical EngineeringMaterials ScienceMicroelectronicsSemiconductor DevicesThermal AnalysisDevice CharacterizationSemiconductor PhysicsTemperature MeasurementWide Band Gap SemiconductorsWide-bandgap Semiconductor DevicesWide-bandgap SemiconductorsGallium Nitride (Gan) MaterialsGallium Nitride Power DevicesHigh-electron-mobility TransistorsInfrared MicroscopyJunction ResistanceJunction Temperature EstimationMicroscopyThermal Resistance
This paper presents a method based on IV pulsed characterizations to estimate the junction temperature of AlGaN/GaN high-electron mobility transistors (AlGaN/GaN HEMTs). This technique allows a 2D plan evaluation of the average temperature of the transistor and the thermal resistance as a function of the dissipated power and the base plate temperature. In order to validate this method, our outcomes are compared with infra-red (IR) microscopy measurements realized with a Quantum Focus Instrument (QFI) Infrascope. The measured data show a good agreement with the results of our approach. Further analyses are carried out with IR microscopy to investigate the dependence of temperature on electrical parameters.
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J. Kuzmı́k, R. Javorka, A. Alam et al. · IEEE Transactions on Electron Devices · 2002 · 214 citations · Full text
Engineering, Electrical Engineering, Materials Engineering +17