Japanese Journal of Applied Physics · 2017 · 59 citations · 16 references
Wide-bandgap SemiconductorElectrical EngineeringSemiconductor DeviceEngineeringApplied PhysicsPower Semiconductor DeviceGan SbdsCmos-compatible Contact MaterialGan Power DeviceFree-standing Gan WaferMicroelectronicsGan WaferPower Electronic Devices
In this paper, we report the formation of vertical GaN Schottky barrier diodes (SBDs) on a 2-in. free-standing (FS) GaN wafer, using CMOS-compatible contact material. By realizing an off-state breakdown voltage VBR of 1200 V and an on-state resistance Ron of 7 mΩ·cm2, the FS-GaN SBDs fabricated in this work achieve a power device figure-of-merit of 2.1 × 108 V2·Ω−1·cm−2 on a high quality GaN wafer. In addition, the fabricated FS-GaN SBDs show the highest Ion/Ioff current ratio of ∼2.3 × 1010 among the GaN SBDs reported in the literature.
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Y. Saitoh, Kazuhide Sumiyoshi, Masaya Okada et al. · Applied Physics Express · 2010 · 257 citations
Wide-bandgap Semiconductor, Semiconductor Technology, Electrical Engineering +14
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Yuhao Zhang, Min Sun, Daniel Piedra et al. · IEEE Electron Device Letters · 2014 · 179 citations
Semiconductors, Wide-bandgap Semiconductor, Electrical Engineering +9
Recombination Properties of Gold in Silicon
G. Bemski · Physical Review · 1958 · 162 citations