Prediction of deformation during manufacturing processes of silicon interposer package with TSVs

Nonlinear Thermal Stress/Strain Analyses of Copper Filled TSV (Through Silicon Via) and Their Flip-Chip Microbumps

Cheryl Selvanayagam, John H. Lau, Xiaowu Zhang et al. · IEEE Transactions on Advanced Packaging · 2009 · 290 citations

Engineering, Most Tsvs, Thermal Expansion +26

Solder joint reliability of flip chip and plastic ball grid array assemblies under thermal, mechanical, and vibrational conditions

John H. Lau · IEEE Transactions on Components Packaging and Manufacturing Technology Part B · 1996 · 110 citations

Engineering, Mechanical Engineering, Environmental Stress Factors +18

Development of through silicon via (TSV) interposer technology for large die (21×21mm) fine-pitch Cu/low-k FCBGA package

Xiaowu Zhang, T.C. Chai, John H. Lau et al. · 2009 · 109 citations

Engineering, Computer Architecture, Large Die +17

Investigation of Thermomechanical Behaviors of Flip Chip BGA Packages During Manufacturing Process and Thermal Cycling

Μ. Y. Tsai, C. H. Hsu, C.T.O. Wang · IEEE Transactions on Components and Packaging Technologies · 2004 · 108 citations

Engineering, Thermomechanical Behaviors, Mechanical Engineering +20

Warpage Analysis of Flip-Chip PBGA Packages Subject to Thermal Loading

Hsing-Yu Chang, Michael Pecht · IEEE Transactions on Device and Materials Reliability · 2009 · 73 citations

Engineering, Mechanical Engineering, Flip-chip Pbga Packages +17