Concepedia

Yeonsung Kim

YK

Statistics

Publications

5

Citations

109

H-Index

5

Active since

2012

Affiliations

Binghamton University(Current)

Analog Devices (United States)

Yeonsung Kim is an author at Binghamton University specializing in mechanics of materials, mechanical engineering, and engineering.

Top concepts

EngineeringMaterial ScienceMechanical EngineeringMechanics Of MaterialsMechanical BehaviorElectronic PackagingMechanical PropertiesRheologyMechanicsMicrostructure

Publications per year

2012–2016

5

Publications

5

Prediction of deformation during manufacturing processes of silicon interposer package with TSVs

Yeonsung Kim, Ah‐Young Park, Chin‐Li Kao et al. · Microelectronics Reliability · 2016 · 32 citations

Materials Science, Chip-scale Package, Engineering +10

Investigation of Stress in MEMS Sensor Device Due to Hygroscopic and Viscoelastic Behavior of Molding Compound

Yeonsung Kim, Dapeng Liu, Hohyung Lee et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2015 · 31 citations

Mems Devices, Engineering, Micromechanics +22

Optimal Material Properties of Molding Compounds for MEMS Package

Yeonsung Kim, Hohyung Lee, Xin Zhang et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2014 · 21 citations

Engineering, Micromechanics, Mechanical Engineering +18

Stress evolution in an encapsulated MEMS package due to viscoelasticity of packaging materials

Seungbae Park, Dapeng Liu, Yeonsung Kim et al. · 2012 · 15 citations

Mems Sensor, Engineering, Micromechanics +17

Moisture Diffusion and Hygroscopic Swelling of Adhesives in Electronics Packaging

Ruiyang Liu, Huayan Wang, Jing Wang et al. · 2016 · 10 citations

Materials Science, Moisture Diffusion, Engineering +14

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