Ruiyang Liu

Comprehensive Study on 2.5D Package Design for Board-Level Reliability in Thermal Cycling and Power Cycling

Shuai Shao, Yuling Niu, Jing Wang et al. · 2018 · 47 citations

Engineering, Energy Efficiency, Maximum Junction Temperature +19

Investigation of Stress in MEMS Sensor Device Due to Hygroscopic and Viscoelastic Behavior of Molding Compound

Yeonsung Kim, Dapeng Liu, Hohyung Lee et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2015 · 31 citations

Mems Devices, Engineering, Micromechanics +22

Morphologies and grain orientations of Cu–Sn intermetallic compounds in Sn3.0Ag0.5Cu/Cu solder joints

Wei Liu, Yanhong Tian, Chunqing Wang et al. · Materials Letters · 2012 · 27 citations

Materials Engineering, Grain Orientations, Materials Science +8

In Situ Visualization and SERS Monitoring of the Interaction between Tumor and Endothelial Cells Using 3D Microfluidic Networks

Ziting Qian, Jiayuan Fei, Shenfei Zong et al. · ACS Sensors · 2019 · 27 citations

Tissue Engineering, Collagen Matrix, Nanotherapeutics +25

Advancement in simulating moisture diffusion in electronic packages under dynamic thermal loading conditions

Jing Wang, Ruiyang Liu, Dapeng Liu et al. · Microelectronics Reliability · 2017 · 26 citations

Moisture Diffusion, Engineering, Refrigeration +16