Advancement in simulating moisture diffusion in electronic packages under dynamic thermal loading conditions

Reformulation of elasticity theory for discontinuities and long-range forces

Stewart Silling · Journal of the Mechanics and Physics of Solids · 2000 · 4.1K citations

Natural Sciences, Mechanical Engineering, Physics +14

Moisture absorption and desorption predictions for plastic ball grid array packages

Jesse Galloway, B.M. Miles · IEEE Transactions on Components Packaging and Manufacturing Technology Part A · 1997 · 188 citations

Natural Sciences, Materials Engineering, Materials Science +15

Analysis of Package Cracking During Reflow Soldering Process

Makoto Kitano, A. Nishimura, Sueo KAWAI et al. · Reliability physics · 1988 · 181 citations

Engineering, Materials Engineering, Materials Science +9

The Mechanics and Impact of Hygroscopic Swelling of Polymeric Materials in Electronic Packaging

E.H. Wong, R. Rajoo, Sau Koh et al. · Journal of Electronic Packaging · 2002 · 120 citations

Natural Sciences, Materials Engineering, Materials Science +13

Integrated vapor pressure, hygroswelling, and thermo-mechanical stress modeling of QFN package during reflow with interfacial fracture mechanics analysis

Tong Yan Tee, Z.W. Zhong · Microelectronics Reliability · 2003 · 118 citations

Engineering, Materials Engineering, Materials Science +17