Concepedia

Sueo KAWAI

SK

Statistics

Publications

15

Citations

625

H-Index

12

Active since

1981

Affiliations

Hitachi (Japan)(Current)

Sueo KAWAI is an author at Hitachi (Japan) specializing in materials science, materials engineering, and mechanical behavior of materials.

Publications per year

1981–2003

15

Publications

15

Analysis of Package Cracking During Reflow Soldering Process

Makoto Kitano, A. Nishimura, Sueo KAWAI et al. · Reliability physics · 1988 · 181 citations

, , +9

Analysis of package cracking during reflow soldering process

Masaharu Kitano, A. Nishimura, Sueo KAWAI et al. · 2003 · 115 citations

, , +9

CONSIDERATIONS OF ALLOWABLE STRESS OF CORROSION FATIGUE (FOCUSED ON THE INFLUENCE OF PITTING)

Sueo KAWAI, Ken‐ichi Kasai · Fatigue & Fracture of Engineering Materials & Structures · 1985 · 64 citations

, , +14

Effect of lead frame material on plastic-encapsulated IC package cracking under temperature cycling

A. Nishimura, Sueo KAWAI, Gen Murakami · IEEE Transactions on Components Hybrids and Manufacturing Technology · 1989 · 49 citations

, , +17

Thermal Stress Measurement in Silicon Chips Encapsulated in IC Plastic Packages Under Temperature Cycling

Hideo Miura, Makoto Kitano, A. Nishimura et al. · Journal of Electronic Packaging · 1993 · 38 citations

, , +17

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