Concepedia

Sueo KAWAI

SK

Statistics

Publications

15

Citations

625

H-Index

12

Active since

1981

Affiliations

Hitachi (Japan)(Current)

Sueo KAWAI is an author at Hitachi (Japan) specializing in engineering, mechanical engineering, and mechanics of materials.

Top concepts

EngineeringMechanical EngineeringMechanics Of MaterialsMaterial ScienceElectronic PackagingSolid MechanicsPlasticityAdvanced PackagingMicroelectronicsThermal Engineering

Publications per year

1981–2003

15

Publications

15

Analysis of Package Cracking During Reflow Soldering Process

Makoto Kitano, A. Nishimura, Sueo KAWAI et al. · Reliability physics · 1988 · 181 citations

Materials Science, Moisture Saturation, Engineering +13

Analysis of package cracking during reflow soldering process

Masaharu Kitano, A. Nishimura, Sueo KAWAI et al. · 2003 · 115 citations

Moisture Saturation, Engineering, Mechanical Engineering +16

CONSIDERATIONS OF ALLOWABLE STRESS OF CORROSION FATIGUE (FOCUSED ON THE INFLUENCE OF PITTING)

Sueo KAWAI, Ken‐ichi Kasai · Fatigue & Fracture of Engineering Materials & Structures · 1985 · 64 citations

Materials Science, Corrosion Pit Depth, Corrosion Technology +12

Effect of lead frame material on plastic-encapsulated IC package cracking under temperature cycling

A. Nishimura, Sueo KAWAI, Gen Murakami · IEEE Transactions on Components Hybrids and Manufacturing Technology · 1989 · 49 citations

Engineering, Mechanical Engineering, Mechanics Of Materials +18

Thermal Stress Measurement in Silicon Chips Encapsulated in IC Plastic Packages Under Temperature Cycling

Hideo Miura, Makoto Kitano, A. Nishimura et al. · Journal of Electronic Packaging · 1993 · 38 citations

Engineering, Thermal Stress Measurement, Mechanical Engineering +21

1–5 of 15