Concepedia

A. Nishimura

AN

22

Publications

825

Citations

18

H-Index

1987

Active since

Affiliations

Hitachi (Japan)(Current)

Hitachi (United Kingdom)

Renesas Electronics (Japan)

A. Nishimura is an author at Hitachi (Japan) specializing in materials science, engineering, and mechanical engineering.

Top concepts

EngineeringMaterial ScienceElectronic PackagingMechanical EngineeringPlasticityMechanics Of MaterialsSolid MechanicsMicroelectronicsAdvanced PackagingMicrofabrication

Publications per year

1987–2010

22

Publications

22

Analysis of Package Cracking During Reflow Soldering Process

Makoto Kitano, A. Nishimura, Sueo KAWAI et al. · Reliability physics · 1988 · 181 citations

Materials Science, Moisture Saturation, Engineering +13

Analysis of package cracking during reflow soldering process

Masaharu Kitano, A. Nishimura, Sueo KAWAI et al. · 2003 · 115 citations

Moisture Saturation, Engineering, Mechanical Engineering +16

Life Estimation For IC Plastic Packages Under Temperature Cycling Based on Fracture Mechanics

A. Nishimura, Aritoshi Tatemichi, Hiroki Miura et al. · IEEE Transactions on Components Hybrids and Manufacturing Technology · 1987 · 63 citations

Engineering, Life Prediction, Mechanical Engineering +27

Effect of lead frame material on plastic-encapsulated IC package cracking under temperature cycling

A. Nishimura, Sueo KAWAI, Gen Murakami · IEEE Transactions on Components Hybrids and Manufacturing Technology · 1989 · 49 citations

Engineering, Mechanical Engineering, Mechanics Of Materials +18

A New Method for Measuring Adhesion Strength of IC Molding Compounds

A. Nishimura, Isao Hirose, Naotaka Tanaka · Journal of Electronic Packaging · 1992 · 42 citations

Engineering, Mechanical Engineering, Residual Stress +18

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