A. Nishimura - Concepedia

Author

A. Nishimura

Hitachi (Japan)

Also Known As

A. Nishimura, A.; Nishimura, A. Yamada, Aki Nishimura, Asao NISHIMURA, Asao Nishimura, H. Tamura

Publications

934

Citations

H-Index

Concepts

All Affiliations

Hitachi (Japan)Hitachi (United Kingdom)Renesas Electronics (Japan)

About

A. Nishimura is an author at Hitachi (Japan) specializing in materials science, engineering, and mechanical engineering.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	17	21	794
2	Applied Physics	6	6	146
3	Computer Engineering	2	2	48
4	Chemical Engineering	1	1	19
5	Chemistry	1	1	19

A. Nishimura

Publications

825

Citations

H-Index

Page 1

	Year	Citations
Analysis of Package Cracking During Reflow Soldering Process Makoto Kitano, A. Nishimura, Sueo KAWAI, Reliability physics Materials ScienceMoisture SaturationEngineeringMechanical BehaviorChip On Board	1988	181
Analysis of package cracking during reflow soldering process Masaharu Kitano, A. Nishimura, Sueo KAWAI, Moisture SaturationEngineeringMechanical EngineeringReflow Soldering ProcessMechanics Of Materials	2003	115
Life Estimation For IC Plastic Packages Under Temperature Cycling Based on Fracture Mechanics A. Nishimura, Aritoshi Tatemichi, Hiroki Miura, IEEE Transactions on Components Hybrids and Manufacturing Technology EngineeringLife PredictionMechanical EngineeringMechanics Of MaterialsFracture Modeling	1987	63
Effect of lead frame material on plastic-encapsulated IC package cracking under temperature cycling A. Nishimura, Sueo KAWAI, Gen Murakami IEEE Transactions on Components Hybrids and Manufacturing Technology EngineeringMechanical EngineeringMechanics Of MaterialsStructural MaterialsAdvanced Packaging (Semiconductors)	1989	49
A New Method for Measuring Adhesion Strength of IC Molding Compounds A. Nishimura, Isao Hirose, Naotaka Tanaka Journal of Electronic Packaging EngineeringMechanical EngineeringResidual StressMolding (Process)Adhesion Strength Evaluation	1992	42
Thermal Stress Measurement in Silicon Chips Encapsulated in IC Plastic Packages Under Temperature Cycling Hideo Miura, Makoto Kitano, A. Nishimura, Journal of Electronic Packaging EngineeringThermal Stress MeasurementMechanical EngineeringAdvanced Packaging (Semiconductors)Stressstrain Analysis	1993	38
Device Characteristic Changes Caused by Packaging Stress Hideo Miura, A. Nishimura	1994	31
Advanced IC packaging for the future applications I. Anjoh, A. Nishimura, S. Eguchi IEEE Transactions on Electron Devices Advanced PackagingElectrical EngineeringAdvanced Ic PackagingEngineeringPortable Electronic Equipment	1998	27
Evaluating IC-package interface delamination by considering moisture-induced molding-compound swelling N. Tanaka, Masaharu Kitano, Tetsuo KUMAZAWA, IEEE Transactions on Components and Packaging Technologies Interface DelaminationFood PackagingEngineeringMechanical EngineeringSoft Matter	1999	26
Development and application of the stress sensing test chip for IC plastic packages. Hideo Miura, A. Nishimura, Sueo KAWAI, TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series A EngineeringSi ChipIntegrated CircuitsSilicon On InsulatorRubber Paste	1987	26

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