N. Tanaka

Low-leakage-current and low-operating-voltage buried photodiode for a CMOS imager

I. Inoue, N. Tanaka, Hirofumi Yamashita et al. · IEEE Transactions on Electron Devices · 2003 · 67 citations

Engineering, Electrical Engineering, Microelectronics +16

Mechanical effects of copper through-vias in a 3D die-stacked module

N. Tanaka, T. Sato, Youhei Yamaji et al. · 2003 · 39 citations

Engineering, Materials Engineering, Materials Science +17

Evaluating IC-package interface delamination by considering moisture-induced molding-compound swelling

N. Tanaka, Masaharu Kitano, Tetsuo KUMAZAWA et al. · IEEE Transactions on Components and Packaging Technologies · 1999 · 27 citations

Engineering, Materials Engineering, Materials Science +17

Ultra-Thin 3D-Stacked SIP Formed using Room-Temperature Bonding between Stacked Chips

N. Tanaka, Y. Yoshimira, T. Naito et al. · 2005 · 22 citations

Engineering, Computer Engineering, Materials Science +17

Low-Cost Through-hole Electrode Interconnection for 3D-SiP Using Room-temperature Bonding

N. Tanaka, Yasuhiro Yoshimura, T. Naito et al. · 2006 · 15 citations

Engineering, Electrical Engineering, Manufacturing Engineering +17