Statistics
Publications
1
Citations
22
H-Index
1
Active since
2005
Affiliations
Hitachi (Japan)(Current)
Y. Yoshimira is an author at Hitachi (Japan) specializing in wire bonding, chip packaging, and three-dimensional integrated circuit interconnects.
Publications per year
2005–2005
1
1
Ultra-Thin 3D-Stacked SIP Formed using Room-Temperature Bonding between Stacked Chips
N. Tanaka, Y. Yoshimira, T. Naito et al. · 2005 · 22 citations
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