Tetsuo KUMAZAWA - Concepedia

Author

Tetsuo KUMAZAWA

Hitachi (Japan)

Also Known As

T. KUMAZAWA, T. Kumazawa, Tetsuo KUMAZAWA, Tetsuo Kumazawa

Publications

449

Citations

H-Index

Concepts

All Affiliations

Hitachi (Japan)

About

Tetsuo KUMAZAWA is an author at Hitachi (Japan) specializing in engineering, mechanical engineering, and materials science.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	9	9	361
2	Applied Physics	3	3	242
3	Business	1	1	12
4	Education	1	1	12
5	Chemical Engineering	1	1	13

Tetsuo KUMAZAWA

Publications

361

Citations

H-Index

Page 1

	Year	Citations
Effect of external stress on polarization in ferroelectric thin films Tetsuo KUMAZAWA, Yukihiro Kumagai, Hideo Miura, Applied Physics Letters Materials ScienceMaterials EngineeringMultiferroicsEngineeringFerroelectric Application	1998	125
A Visco-Plastic Constitutive Model for 60/40 Tin-Lead Solder Used in IC Package Joints Esteban P. Busso, Masaharu Kitano, Tetsuo KUMAZAWA Journal of Engineering Materials and Technology EngineeringSevere Plastic DeformationMechanical EngineeringIc Package JointsSurface-mount Ic Packages	1992	105
Modeling Complex Inelastic Deformation Processes in IC Packages’ Solder Joints Esteban P. Busso, Masaharu Kitano, Tetsuo KUMAZAWA Journal of Electronic Packaging EngineeringMechanical EngineeringComputer-aided DesignMechanics Of MaterialsStructural Materials	1994	37
Evaluating IC-package interface delamination by considering moisture-induced molding-compound swelling N. Tanaka, Masaharu Kitano, Tetsuo KUMAZAWA, IEEE Transactions on Components and Packaging Technologies Interface DelaminationFood PackagingEngineeringMechanical EngineeringSoft Matter	1999	26
Absolute frequency identification and stabilisation of DFB lasers in 1.5 μm region Mikio Maeda, John R. Barry, Tetsuo KUMAZAWA, Electronics Letters EngineeringAbsolute Frequency IdentificationLaser ScienceOptical TestingLaser Applications	1989	17
Evaluation of interface delamination in IC packages by considering swelling of the molding compound due to moisture absorption N. Tanaka, Masaharu Kitano, Tetsuo KUMAZAWA, Interface DelaminationEngineeringMechanical EngineeringMechanics Of MaterialsMolding (Process)	2002	14
Polarization-selective photochromic reaction in glassy polymers: effects of local relaxation processes of polymer matrix Qui Tran Cong, Tetsuo KUMAZAWA, Okimichi Yano, Macromolecules Macromolecular ChemistryEngineeringResponsive PolymersAltmetric Attention ScoreOrganic Chemistry	1990	13
Adaptive control of pulsed MIG welding using image processing systems M. Yamamoto, Yasuyoshi Kaneko, Kensuke Fujii, Conference Record of the 1988 IEEE Industry Applications Society Annual Meeting Robotic SystemsEngineeringFriction WeldingIndustrial EngineeringMechanical Engineering	2003	12
An Advanced Defect-Monitoring Test Structure for Electrical Screening and Defect Localization Y. Hamamura, Tetsuo KUMAZAWA, Kazuyuki Tsunokuni, IEEE Transactions on Semiconductor Manufacturing EngineeringInspectionMeasurementMicroscopyDiagnosis	2004	12

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