Advanced IC packaging for the future applications

TLDR

Electronic equipment performance is rapidly improving, driving demand for smaller, thinner, and higher‑speed IC packaging that protects integrity and enhances system performance. The study aims to prioritize packaging technology in system design to achieve optimal performance, reliability, and cost. Chip Scale Package (CSP) is introduced as an ideal technology for next‑generation electronic equipment, addressing key miniaturization and performance challenges.

Abstract

The performance of electronic equipment is improving rapidly. Portable electronic equipment requires smaller and thinner packaging systems for saving space and miniaturization. In addition, highly integrated, high-speed applications demand improved electrical performance to minimize noise effects. As a result of these considerations, the role of IC packaging has expanded from its traditional role of protecting the integrity and performance of an IC, to being a central factor in the development of electronic system concepts. In developing the optimum system, packaging technology must be a prime design consideration to ensure optimum performance, reliability, and cost. Soldering technology and Printed Wiring Board (PWB) routing density are two of the major technological issues facing miniaturized packaging systems today. Chip Scale Package (CSP), which is a new concept in packaging technology has been introduced. This is an ideal technology to enable the design and manufacture of the next generation of electronic equipment, while overcoming many of the technological issues facing system development.