Concepedia

Author

Naotaka Tanaka

Association of Super-Advanced Electronics

Also Known As

Naotaka TANAKA, Naotaka Tanaka

42

Publications

338

Citations

7

H-Index

24

Concepts

All Affiliations

Association of Super-Advanced ElectronicsHitachi (Japan)
NT

About

Naotaka Tanaka is an author at Association of Super-Advanced Electronics specializing in engineering, materials science, and electronic packaging.

Top Concepts

#ConceptH-IndexPublicationsCitations

1

Engineering

6

6

305

2

Materials Science

6

6

305

3

Applied Physics

3

3

183

4

Computer Engineering

2

2

138

5

Electrical Engineering

2

2

138

Naotaka Tanaka

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6

Publications

305

Citations

6

H-Index

YearCitations

Micro Cu Bump Interconnection on 3D Chip Stacking Technology

Kazumasa Tanida, Mitsuo Umemoto, Naotaka Tanaka,

Japanese Journal of Applied Physics

2004

84

Ultra-high-density interconnection technology of three-dimensional packaging

Kenji Takahashi, Mitsuo Umemoto, Naotaka Tanaka,

Microelectronics Reliability

2003

80

Au Bump Interconnection in 20 µm Pitch on 3D Chip Stacking Technology

Kazumasa Tanida, Mitsuo Umemoto, Tadahiro Morifuji,

Japanese Journal of Applied Physics

2003

54

A New Method for Measuring Adhesion Strength of IC Molding Compounds

A. Nishimura, Isao Hirose, Naotaka Tanaka

Journal of Electronic Packaging

1992

42

Measurement of IC Molding Compound Adhesion Strength and Prediction of Interface Delamination Within Package.

Naotaka Tanaka, A. Nishimura

TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series A

1994

26

A Highly Reliable Design for a Nonmetallurgical Contact-Joint Structure Consisting of an Adhesive Film

Naotaka Tanaka, Kenya KAWANO, Hideo Miura,

Journal of Electronic Packaging

2004

19

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