Concepedia

Naotaka Tanaka

NT

6

Publications

305

Citations

6

H-Index

1992

Active since

Affiliations

Association of Super-Advanced Electronics(Current)

Hitachi (Japan)

Naotaka Tanaka is an author at Association of Super-Advanced Electronics specializing in engineering, materials science, and electronic packaging.

Top concepts

EngineeringMaterial ScienceElectronic Packaging3D PrintingMicrofabricationApplied PhysicsMicroelectronicsAdvanced PackagingMechanical EngineeringMechanics Of Materials

Publications per year

1992–2004

6

Publications

6

Micro Cu Bump Interconnection on 3D Chip Stacking Technology

Kazumasa Tanida, Mitsuo Umemoto, Naotaka Tanaka et al. · Japanese Journal of Applied Physics · 2004 · 84 citations

Engineering, Integrated Circuits, Interconnect (Integrated Circuits) +19

Ultra-high-density interconnection technology of three-dimensional packaging

Kenji Takahashi, Mitsuo Umemoto, Naotaka Tanaka et al. · Microelectronics Reliability · 2003 · 80 citations

Materials Science, 3D Ic Architecture, Engineering +7

Au Bump Interconnection in 20 µm Pitch on 3D Chip Stacking Technology

Kazumasa Tanida, Mitsuo Umemoto, Tadahiro Morifuji et al. · Japanese Journal of Applied Physics · 2003 · 54 citations

Au Bump Interconnection, Electrical Resistance, Engineering +20

A New Method for Measuring Adhesion Strength of IC Molding Compounds

A. Nishimura, Isao Hirose, Naotaka Tanaka · Journal of Electronic Packaging · 1992 · 42 citations

Engineering, Mechanical Engineering, Residual Stress +18

Measurement of IC Molding Compound Adhesion Strength and Prediction of Interface Delamination Within Package.

Naotaka Tanaka, A. Nishimura · TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series A · 1994 · 26 citations

Materials Science, Interface Delamination, Engineering +12

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