Concepedia

Kazumasa Tanida

KT

Statistics

Publications

8

Citations

463

H-Index

8

Active since

2003

Affiliations

Association of Super-Advanced Electronics(Current)

Kazumasa Tanida is an author at Association of Super-Advanced Electronics specializing in engineering, electronic materials, and chip packaging.

Publications per year

2003–2009

8

Publications

8

Micro Cu Bump Interconnection on 3D Chip Stacking Technology

Kazumasa Tanida, Mitsuo Umemoto, Naotaka Tanaka et al. · Japanese Journal of Applied Physics · 2004 · 84 citations

Engineering, Materials Engineering, Materials Science +17

Ultra-high-density interconnection technology of three-dimensional packaging

Kenji Takahashi, Mitsuo Umemoto, Naotaka Tanaka et al. · Microelectronics Reliability · 2003 · 80 citations

Engineering, Electrical Engineering, Materials Science +14

High-performance vertical interconnection for high-density 3D chip stacking package

M. Umemoto, Kazumasa Tanida, Y. Nemoto et al. · 2004 · 74 citations

Engineering, Computer Engineering, Electrical Engineering +17

Au Bump Interconnection with Ultrasonic Flip-Chip Bonding in 20 µm Pitch

Kazumasa Tanida, Mitsuo Umemoto, Yoshihiro TOMITA et al. · Japanese Journal of Applied Physics · 2003 · 61 citations

Engineering, Materials Engineering, Materials Science +15

Chip Scale Camera Module (CSCM) using Through-Silicon-Via (TSV)

Hiroshi Yoshikawa, A. Kawasaki, Tomoaki et al. · 2009 · 55 citations

Engineering, Computer Engineering, Electrical Engineering +17

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