Chip Scale Camera Module (CSCM) using Through-Silicon-Via (TSV)

Abstract

Through silicon via (TSV) is one of the necessary technologies for three-dimensional integration of LSIs. Heterogeneous system integration is a good candidate for its application, which includes the "Vision Chip". TSV technology is applied to a CMOS imager sensor camera module for mobile handsets and successfully achieves a size reduction of 55% in volume and 36% in footprint, which we refer to as a chip scale camera module (CSCM). To the best of the authors' knowledge, CSCM is the first mass-produced product using TSV technology.