Iiduka is an author at Toshiba (Japan) specializing in electronic packaging, instrumentation, and technology.
Top concepts
EducationTechnologyEngineering3D IntegrationInstrumentationMicroelectronicsMicrofabricationComputer EngineeringElectronic PackagingComputer Architecture
Publications per year
2009–2009
1
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Chip Scale Camera Module (CSCM) using Through-Silicon-Via (TSV)
Hiroshi Yoshikawa, A. Kawasaki, Tomoaki et al. · 2009 · 55 citations
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