Concepedia

M. Tomisaka

MT

Statistics

Publications

5

Citations

313

H-Index

5

Active since

2002

Affiliations

Association of Super-Advanced Electronics(Current)

Okayama University

M. Tomisaka is an author at Association of Super-Advanced Electronics specializing in three-dimensional integration, engineering, and chip packaging.

Publications per year

2002–2004

5

Publications

5

High-Aspect-Ratio Copper Via Filling Used for Three-Dimensional Chip Stacking

Jian‐Jun Sun, Kazuo Kondo, Takuji Okamura et al. · Journal of The Electrochemical Society · 2003 · 148 citations · Full text

Engineering, Materials Engineering, Materials Science +15

Process integration of 3D chip stack with vertical interconnection

Kenji Takahashi, Yuichi Taguchi, M. Tomisaka et al. · 2004 · 84 citations

Engineering, Electrical Engineering, Materials Engineering +17

Development of advanced 3D chip stacking technology with ultra-fine interconnection

Kenji Takahashi, M. Hoshino, H. Yonemura et al. · 2002 · 45 citations

Engineering, Electrical Engineering, Manufacturing Engineering +17

Thermal characterization of bare-die stacked modules with Cu through-vias

Youhei Yamaji, Takashi Ando, Tadahiro Morifuji et al. · 2002 · 19 citations

Engineering, Materials Engineering, Materials Science +17

Development of wafer thinning and double-sided bumping technologies for the three-dimensional stacked LSI

Masahiro Sunohara, Tomoya Fujii, M. Hoshino et al. · 2003 · 17 citations

Engineering, Electrical Engineering, Materials Science +15

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