Concepedia

H. Yonemura

HY

4

Publications

291

Citations

4

H-Index

2002

Active since

Affiliations

Association of Super-Advanced Electronics(Current)

Okayama University

H. Yonemura is an author at Association of Super-Advanced Electronics specializing in 3d printing, microfabrication, and engineering.

Top concepts

3D PrintingEngineeringMicroelectronicsMicrofabricationElectronic Packaging3D IntegrationMaterial ScienceElectrical EngineeringApplied PhysicsComputer Engineering

Publications per year

2002–2004

4

Publications

4

High-Aspect-Ratio Copper Via Filling Used for Three-Dimensional Chip Stacking

Jian‐Jun Sun, Kazuo Kondo, Takuji Okamura et al. · Journal of The Electrochemical Society · 2003 · 146 citations

Engineering, Three-dimensional Chip Stacking, Interconnect (Integrated Circuits) +18

Process integration of 3D chip stack with vertical interconnection

Kenji Takahashi, Yuichi Taguchi, M. Tomisaka et al. · 2004 · 84 citations

Engineering, Mechanical Engineering, Computer Architecture +19

Development of advanced 3D chip stacking technology with ultra-fine interconnection

Kenji Takahashi, M. Hoshino, H. Yonemura et al. · 2002 · 44 citations

3D Ic Architecture, Wafer Scale Processing, Engineering +15

Development of wafer thinning and double-sided bumping technologies for the three-dimensional stacked LSI

Masahiro Sunohara, Tomoya Fujii, M. Hoshino et al. · 2003 · 17 citations

Engineering, Thin Form Factor, Mechanical Engineering +20

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