Concepedia

Takuji Okamura

TO

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Publications

1

Citations

146

H-Index

1

Active since

2003

Affiliations

Okayama University(Current)

Takuji Okamura is an author at Okayama University specializing in surface science, electrochemistry, and microelectronics.

Top concepts

3D PrintingEngineeringApplied PhysicsSurface ScienceElectrochemistryMaterial ScienceMicroelectronicsMicrofabricationElectronic PackagingElectrical Engineering

Publications per year

2003–2003

1

Publications

1

High-Aspect-Ratio Copper Via Filling Used for Three-Dimensional Chip Stacking

Jian‐Jun Sun, Kazuo Kondo, Takuji Okamura et al. · Journal of The Electrochemical Society · 2003 · 146 citations

Engineering, Three-dimensional Chip Stacking, Interconnect (Integrated Circuits) +18

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