Tadahiro Morifuji

Current Status of Research and Development for Three-Dimensional Chip Stack Technology

Kenji Takahashi, Hiroshi Terao, Yoshihiro TOMITA et al. · Japanese Journal of Applied Physics · 2001 · 175 citations

Engineering, Electrical Engineering, Microelectronics +12

Au Bump Interconnection in 20 µm Pitch on 3D Chip Stacking Technology

Kazumasa Tanida, Mitsuo Umemoto, Tadahiro Morifuji et al. · Japanese Journal of Applied Physics · 2003 · 55 citations

Engineering, Materials Engineering, Materials Science +16

Mechanical effects of copper through-vias in a 3D die-stacked module

N. Tanaka, T. Sato, Youhei Yamaji et al. · 2003 · 39 citations

Engineering, Materials Engineering, Materials Science +17

Advanced packaging technologies on 3D stacked LSI utilizing the micro interconnections and the layered microthin encapsulation

Y. Tomita, Tadahiro Morifuji, Tatsuya Ando et al. · 2002 · 23 citations

Engineering, Materials Engineering, Materials Science +17

Thermal characterization of bare-die stacked modules with Cu through-vias

Youhei Yamaji, Takashi Ando, Tadahiro Morifuji et al. · 2002 · 19 citations

Engineering, Materials Engineering, Materials Science +17