Concepedia

Mitsuo Umemoto

MU

6

Publications

317

Citations

6

H-Index

2003

Active since

Affiliations

Association of Super-Advanced Electronics(Current)

Mitsuo Umemoto is an author at Association of Super-Advanced Electronics specializing in electronic packaging, microelectronics, and engineering.

Top concepts

EngineeringMicroelectronicsElectronic PackagingMaterial Science3D PrintingApplied PhysicsMicrofabricationAdvanced PackagingIntegrated CircuitsElectrical Engineering

Publications per year

2003–2004

6

Publications

6

Micro Cu Bump Interconnection on 3D Chip Stacking Technology

Kazumasa Tanida, Mitsuo Umemoto, Naotaka Tanaka et al. · Japanese Journal of Applied Physics · 2004 · 84 citations

Engineering, Integrated Circuits, Interconnect (Integrated Circuits) +19

Ultra-high-density interconnection technology of three-dimensional packaging

Kenji Takahashi, Mitsuo Umemoto, Naotaka Tanaka et al. · Microelectronics Reliability · 2003 · 80 citations

Materials Science, 3D Ic Architecture, Engineering +7

Au Bump Interconnection with Ultrasonic Flip-Chip Bonding in 20 µm Pitch

Kazumasa Tanida, Mitsuo Umemoto, Yoshihiro TOMITA et al. · Japanese Journal of Applied Physics · 2003 · 60 citations

Au Bump Interconnection, Solid Phase, Engineering +17

Au Bump Interconnection in 20 µm Pitch on 3D Chip Stacking Technology

Kazumasa Tanida, Mitsuo Umemoto, Tadahiro Morifuji et al. · Japanese Journal of Applied Physics · 2003 · 54 citations

Au Bump Interconnection, Electrical Resistance, Engineering +20

Fabrication of High-Density Wiring Interposer for 10 GHz 3D Packaging Using a Photosensitive Multiblock Copolymerized Polyimide

Katsuya Kikuchi, S. Segawa, Eun-Sil Jung et al. · Japanese Journal of Applied Physics · 2004 · 29 citations

Ghz 3D, Optical Materials, Engineering +22

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