Ultra-high-density interconnection technology of three-dimensional packaging - Concepedia

Concepedia

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Ultra-high-density interconnection technology of three-dimensional packaging

80

Citations

13

References

2003

Year

Kenji Takahashi, Mitsuo Umemoto, Naotaka Tanaka, Kazumasa Tanida, Y. Nemoto, Yoshihiro TOMITA, M. Tago, Manabu Bonkohara

Microelectronics Reliability

Materials Science3D Ic ArchitectureEngineeringAdvanced Packaging (Semiconductors)Applied PhysicsUltra-high-density Interconnection TechnologyElectronic PackagingMicroelectronics3D PrintingInterconnect (Integrated Circuits)

References

	Year	Citations

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