Manabu Bonkohara

Statistics

Publications

Citations

343

H-Index

Active since

2001

Affiliations

Association of Super-Advanced Electronics(Current)

Tokyo Institute of Technology

Manabu Bonkohara is an author at Association of Super-Advanced Electronics specializing in engineering, electrical engineering, and semiconductor devices.

Publications per year

2001–2009

Publications

Current Status of Research and Development for Three-Dimensional Chip Stack Technology

Kenji Takahashi, Hiroshi Terao, Yoshihiro TOMITA et al. · Japanese Journal of Applied Physics · 2001 · 175 citations

Engineering, Electrical Engineering, Microelectronics +12

Ultra-high-density interconnection technology of three-dimensional packaging

Kenji Takahashi, Mitsuo Umemoto, Naotaka Tanaka et al. · Microelectronics Reliability · 2003 · 80 citations

Engineering, Electrical Engineering, Materials Science +14

Implementation of active interposer for high-speed and low-cost chip level optical interconnects

Takashi Mikawa, Moto Kinoshita, K. Hiruma et al. · IEEE Journal of Selected Topics in Quantum Electronics · 2003 · 35 citations

Engineering, Electrical Engineering, Materials Science +17

Trends and opportunities of system-in-a-package and three-dimensional integration

Manabu Bonkohara, Kenji Takahashi, M. Ishino · Electronics and Communications in Japan (Part II Electronics) · 2005 · 21 citations

Engineering, Electrical Engineering, Materials Science +13

Photolithographic packaging with selectively occupied repeated transfer (PL-Pack with SORT) for scalable film optical link multichip-module (S-FOLM)

Tomoyuki Yoshimura, K. Kumai, Takashi Mikawa et al. · IEEE Transactions on Electronics Packaging Manufacturing · 2002 · 11 citations

Engineering, Electrical Engineering, Materials Science +17

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